Epoxy curing agent with slow curing schedule. Long pot-life and low peak temperature makes it suitable for both impregnation and mounting of heat sensitive specimens.
Cures in 8-24 h at 22 ℃. Peak temperature is 40 ℃ in a 40 mm dia. mount. For best results apply a post-cure at 100 ℃ for 1 h.
It is recommended to use forced cooling in a fume hood with moulds larger than 40 mm dia. to avoid thermal runaway.
Mix exactly 12 g of Aka-Cure Slow with 100 g of Aka-Resin Liquid Epoxy (alternatively,13.5 ml/100 ml).
Viscosity: 20 cps at 25 ℃.
Mould Release Agents
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