Aka-Resin Phenolic SEM

Conductive black phenolic resin for hot mounting – recommended for SEM work.

Curing specifications
Dia., force, heating/cooling time:
25 mm: 10 kN, 3-5 min/2-3 min
30 mm: 20 kN, 3-6 min/2-4 min
40 mm: 30 kN, 5-7 min/3-5 min
50 mm: 50 kN, 6-9 min/4-6 min

Cure at 160 – 180 °C, 250 bar, high cooling rate.

If the mount is not fully cured, increase time.

The parameters above can vary a lot depending on the characteristics of the mounting press used.

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Additional information

Content available

1 kg, 7.5 kg

  • Mould release powder for hot mounting presses.

    Mould Release Agents

    Aka-NoStick Powder

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